Method for treating plate
US9873935B2 · kind B2 · utility
1Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2015 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Jan 22, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C10/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for locally treating a plate is disclosed. A pattern formed from a compound containing at least one alloying element is applied onto at least one surface of the plate. At least the surface of a contacting layer including the pattern is covered by adequately heat-resistant material. The plate is subsequently heat treated in order to diffuse the alloying element into the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.