Patent · US Active

Method for treating plate

US9873935B2 · kind B2 · utility

1Cited by
3References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 1, 2015
Grant dateJan 23, 2018
Priority date
Expiry dateJan 22, 2036

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C10/30
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method for locally treating a plate is disclosed. A pattern formed from a compound containing at least one alloying element is applied onto at least one surface of the plate. At least the surface of a contacting layer including the pattern is covered by adequately heat-resistant material. The plate is subsequently heat treated in order to diffuse the alloying element into the plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.