Co-packaging photonic integrated circuits and application specific integrated circuits

US9874688B2 · kind B2 · utility

Assignee

• ACACIA COMMUNICATIONS, INC. · US

Inventors

• Christopher Doerr · Fryeburg, US
• Eric Swanson · Gloucester, US
• Diedrik Vermeulen · New York, US
• Saeid Azemati · Waltham, US
• Jon Stahl · Maynard, US

Key dates

• Filing date: Apr 26, 2013
• Grant date: Jan 23, 2018
• Expiry date: Apr 26, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/16225
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.