Heat sink with orientable fins
US9875951B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2011 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Jan 17, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.