Method for producing an optoelectronic semiconductor chip
US9876001B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2017 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Mar 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for producing an optoelectronic semiconductor chip is disclosed. In an embodiment, the method includes providing a semiconductor body with a pixel region including different subpixel regions, each subpixel region having a radiation exit face, applying an electrically conductive layer onto the radiation exit face of a subpixel region, wherein the electrically conductive layer is suitable at least in part for forming a salt with a protic reactant, and depositing a conversion layer on the electrically conductive layer using an electrophoresis process, wherein the deposited conversion layer comprises pores.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.