Method for forming copper metallization over TCO of solar cells
US9876135B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Feb 11, 2017 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Feb 11, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/547
Abstract
Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.