Electronic component, optoelectronic component, component arrangement, and method for producing an electronic component

US9876148B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Luca Haiberger · Regensburg, DE
• Matthias Sperl · Mintraching, DE

Key dates

• Filing date: Aug 4, 2015
• Grant date: Jan 23, 2018
• Expiry date: Aug 4, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/036
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic component, an optoelectronic component, a component arrangement, and a method for producing an electronic component are disclosed. In an embodiment, the method includes forming a sacrificial structure on a top side of a carrier by a photolithographic process from a photoresist layer, arranging an electronic semiconductor chip on the carrier after exposing the photoresist layer, molding a molded body around the sacrificial structure and around the electronic semiconductor chip such that a surface of the electronic semiconductor chip is at least partly not covered by the molded body, detaching the molded body from the carrier and removing the sacrificial structure, wherein removing the sacrificial structure results in a cutout being formed in the molded body.