Patent · US Active

Optoelectronic component and method for the production thereof

US9876155B2 · kind B2 · utility

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0References
19Claims
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Assignee

Inventors

Key dates

Filing dateNov 3, 2015
Grant dateJan 23, 2018
Priority date
Expiry dateNov 3, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/8506
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein the optoelectronic semiconductor chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, a second top side metallization is arranged on the top side of the composite body and electrically insulated with respect to the first top side metallization, the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip, and a wavelength-converting material is arranged in a region completely delimited by the second top side metallization on the top side of the composite body, the wavelength-converting material extending as far as the second top side metallization.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.