Method for packaging organic light-emitting diode apparatus, organic light-emitting diode packaging apparatus and display device
US9876195B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
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Key dates
| Filing date | Sep 8, 2016 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Sep 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/135
Abstract
The present disclosure provides a method of packaging an OLED apparatus, an OLED packaging apparatus and a display device, and relates to the field of the OLED. The method includes steps: forming a first inorganic thin film layer on an OLED to be packaged; forming a groove on a surface of the first inorganic thin film layer; forming a second organic thin film layer within the groove; and forming a third inorganic thin film layer covering the first inorganic thin film layer and the second organic thin film layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.