Automated dynamic laser peening system
US9878398B2 · kind B2 · utility
0Cited by
11References
17Claims
0Family size
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Key dates
| Filing date | Nov 13, 2014 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Jun 30, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D10/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods, systems, and apparatuses are disclosed for automated dynamic laser peening of a workpiece. In one embodiment, a system for automated dynamic laser peening of a workpiece comprises: a laser; a laser beam delivery system; and a dynamic platform system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.