Packaged hot-melt pressure sensitive adhesive
US9878515B2 · kind B2 · utility
5Cited by
14References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2014 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Jul 31, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2754
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a packaged hot-melt pressure sensitive adhesive comprising a hot-melt pressure sensitive adhesive composition and a coextrusion coating consisting of neat low density polyethylene, neat polypropylene, or neat ethylene vinyl acetate. The present invention further relates to the use of the packaged adhesive formed as individual forms in an adhesive application process, and the use of the packaged adhesive in the production of laminated articles, including nonwoven hygiene articles, disposable medical drapes, and also laminate constructions such as tapes and labels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.