Patent · US Active

Laser cutting method and articles produced therewith

US9878530B2 · kind B2 · utility

0Cited by
21References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 29, 2011
Grant dateJan 30, 2018
Priority date—
Expiry dateOct 28, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24777
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Laser cutting of multilayer optical film bodies comprising polyester and polycarbonate materials.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.