High bandwidth signal probe tip
US9880198B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2013 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Oct 4, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2805
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A high bandwidth signal probe device and a method of probing a high bandwidth signal are provided. The high bandwidth signal probe device includes a probe tip for probing a stub of a backdrilled via of a printed circuit board. The probe tip is adapted to fit in the backdrilled via. The probe tip has a length adapted to reach the stub of the backdrilled via. The probe tip is adapted to contact a plated portion of the stub of the backdrilled via. A resistive element is associated with the probe tip. The method includes inserting a probe tip of a signal probe device in the backdrilled via, placing the probe tip in contact with a plated portion of the stub of the backdrilled via, and receiving an electrical signal through a path which includes a resistive element of the probe tip of the signal probe device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.