Substrate treating apparatus and substrate treating method
US9881827B2 · kind B2 · utility
2Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2015 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Feb 29, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.