Semiconductor package with three-dimensional antenna
US9881882B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2016 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Oct 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package is provided. The semiconductor package includes a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region. A semiconductor die is disposed on the package substrate in the first region. A three-dimensional (3D) antenna is disposed on the package substrate in the second region. The 3D antenna includes a planar structure portion and a bridge or wall structure portion. A molding compound encapsulates the semiconductor die and at least a portion of the 3D antenna. A conductive shielding element is inside the molding compound or partially covers the molding compound. A semiconductor package assembly having the semiconductor package is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.