Patent · US Active

Handle for semiconductor-on-diamond wafers and method of manufacture

US9882007B2 · kind B2 · utility

1Cited by

7References

16Claims

0Family size

Assignee

RFHIC Corporation · KR

Inventors

Quentin Diduck · Santa Clara, US
Daniel Francis · Oakland, US
Frank Yantis Lowe · Berkeley, US
Felix Ejeckham · Santa Clara, US

Key dates

Filing date	Jul 2, 2013
Grant date	Jan 30, 2018
Priority date	—
Expiry date	Oct 17, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24355
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers (401) to a carrier (407) are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.