Audio driver assembly, headphone including such an audio driver assembly, and related methods
US9883290B2 · kind B2 · utility
1Cited by
31References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2015 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Dec 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R9/025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An audio driver assembly comprises a driver housing and an audio driver secured within the driver housing. The audio driver comprises a magnet assembly, a flexible diaphragm overlying the magnet assembly, and a spacer between the magnet assembly and the flexible diaphragm. A headphone and a method of forming a headphone are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.