Radio-frequency circuit module
US9883585B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 5, 2015 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Jan 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A radio-frequency circuit module includes a multilayer body and a surface-mount component mounted on a front surface of the multilayer body. The surface-mount component includes variable capacitance elements integrated therein. Inductors including conductor patterns are provided in the multilayer body. On a back surface of the multilayer body, a first external connection terminal and a second external connection terminal are sandwiched between ground connection terminals. Ground via-conductors connected to ground connection terminals extend to the front surface of the multilayer body. The ground via-conductors are connected to each other in a layer near the front surface by a ground connection conductor which extends in a direction perpendicular or substantially perpendicular to the extending direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.