Substrate-bonding device and method of the same
US9884452B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2016 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Apr 8, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3475
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of bonding substrates includes steps as follows. Providing a curved glass substrate and a flexible light-transmissive film; moving a roller to press the flexible light-transmissive film onto the curved glass substrate so that the flexible light-transmissive film matches a curvature of the curved glass substrate to gradually fit and bond onto the curved glass substrate; sensing the attaching level of at least one local area of the flexible light-transmissive film bonded on the curved glass substrate; and adjusting a press force exerted by the roller to the local area of the flexible light-transmissive film according to the attaching level during the flexible light-transmissive film is bonded onto the curved glass substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.