Additive manufacturing including layer-by-layer imaging
US9886015B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2015 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Apr 4, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
In some examples, a technique includes forming, on a surface of a first layer of material, a second layer of material using an additive manufacturing process. The technique also may include imaging the second layer using a laser imaging device to generate a second layer image. Further, the technique may include determining, by a computing device, whether a thickness of the second layer, in a direction substantially normal to the surface of the first layer of material, is within a defined range of thickness for the second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.