High temperature superconductor wire bundling system and method
US9887025B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2015 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | May 21, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E40/60
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system for bundling a plurality of high temperature superconductor tapes into a flexible cable, includes a first alignment device for receiving and guiding there through the plurality of high temperature superconductor tapes, each of the tapes arranged with a wide surface oriented at a first angle. There is a second alignment device for receiving and guiding there through the plurality of high temperature superconductor tapes, each of said tapes arranged with the wide surface oriented at a second angle. The first angle is transverse to the second angle and plastically deforms the tapes to impart a twist pitch in the tapes. There is a forming member spaced from the second alignment device for receiving the plurality of high temperature superconductor tapes with the imparted twist pitch and forming them into a bundle of high temperature superconductor tapes of the high temperature superconductor tapes with the imparted twist pitch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.