Surface mount device package having improved reliability
US9887143B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2016 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Mar 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package for mounting to a printed circuit board (PCB) includes a case comprising a ceramic base, a semiconductor die in the case, a mounting pad under the ceramic base and coupled to the semiconductor die through at least one opening in the ceramic base. The mounting pad includes at least one layer having a coefficient of thermal expansion (CTE) approximately matching a CTE of the ceramic base. The mounting pad includes at least one layer having a low-yield strength of equal to or less than 200 MPa. The mounting pad includes at least one copper layer and at least one molybdenum layer. The semiconductor package also includes a bond pad coupled to another mounting pad under the ceramic base through a conductive slug in the ceramic base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.