Systems, methods and devices for inter-substrate coupling
US9887177B2 · kind B2 · utility
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12References
38Claims
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Key dates
| Filing date | Oct 29, 2014 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Oct 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Inter-substrate coupling and alignment using liquid droplets can include electrical and plasmon modalities. For example, a set of droplets can be placed on a bottom substrate. A top substrate can be placed upon the droplets, which uses the droplets to align the substrates. Using the droplets in a capacitive or plasmon coupling modality, information or power can be transferred between the substrates using the droplets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.