Patent · US Active

Infrared sensor, thermal imaging camera and method for producing a microstructure from thermoelectric sensor rods

US9887339B2 · kind B2 · utility

0Cited by

4References

14Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Harry Hedler · Germering, DE
Ingo Kuehne · Künzelsau, DE
Markus Schieber · Munich, DE
Joerg Zapf · Munich, DE

Key dates

Filing date	Feb 11, 2013
Grant date	Feb 6, 2018
Priority date	—
Expiry date	Feb 11, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49201
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An infrared sensor with a microstructure has a multiplicity of sensor rods protruding from a sensor base and arranged axially parallel to one another. Each of the sensor rods is designed as a thermocouple, in that a first rod end, arranged on the sensor base, is electrically connected to an opposite free second rod end by both a first and a second electrically conductive rod element. The two rod elements have a different Seebeck coefficient, and the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.