3D printed active electronic materials and devices
US9887356B2 · kind B2 · utility
16Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2016 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Jan 21, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a process whereby diverse classes of materials can be 3D printed and fully integrated into device components with active properties. An exemplary embodiment shows the seamless interweaving of five different materials, including (1) emissive semiconducting inorganic nanoparticles, (2) an elastomeric matrix, (3) organic polymers as charge transport layers, (4) solid and liquid metal leads, and (5) a UV-adhesive transparent substrate layer, demonstrating the integrated functionality of these materials. Further disclosed is a device for printing these fully integrated 3D devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.