Antenna-integrated wireless module and method for manufacturing antenna-integrated wireless module
US9887454B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2016 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Apr 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q23/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna-integrated wireless module is provided which does not need a metal case, and which can realize size reduction. A shield layer is formed on an upper surface of a resin sealing layer, which is disposed on one principal surface of a substrate and which covers a wireless region and an antenna region, such that the shield layer does not cover a portion of the resin sealing layer, the portion being positioned directly above the antenna region. Hence the shield layer formed on the upper surface of the resin sealing layer on the side covering the wireless region can serve to suppress electromagnetic waves radiated from a wireless functional section, which is disposed in a region overlapping the wireless region when looking at the module in a plan view, and which includes an RF circuit disposed at least on the one principal surface of the substrate or inside the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.