Single-layer metalization and via-less metamaterial structures
US9887465B2 · kind B2 · utility
3Cited by
46References
29Claims
0Family size
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Key dates
| Filing date | Jul 1, 2013 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Mar 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q5/307
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Techniques and apparatus based on metamaterial structures provided for antenna and transmission line devices, including single-layer metallization and via-less metamaterial structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.