Packaged electrical components with supplemental conductive structures
US9888561B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2015 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Jan 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F19/80
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electrical components such as integrated circuits and other components may be mounted on a substrate such as a printed circuit substrate. A molded plastic cap may cover the components and a portion of the printed circuit substrate to form a packaged electrical device. Metal structures such as springs, posts, and other metal members may be insert molded within the plastic cap. A metal layer on the surface of the cap may be patterned to from electromagnetic shielding, signal paths, contact pads, sensor electrodes, antennas, and other structures. Multiple substrates each with a respective set of mounted electrical components may be joined using a flexible printed circuit. The flexible printed circuit may be covered with a rigid cap portion or an elastomeric material or may be left uncovered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.