Heat exchanger for power-electronic components
US9888612B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2017 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Jan 9, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2275/02
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
It is proposed a two-phase heat exchanger device for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate configured for being in contact with a first semiconductor module at a first side of the base plate; and at least one tube element for a first cooling medium including a first portion having at least one evaporator channel and a second portion having at least one condenser channel. The base plate has a groove containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.