Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device
US9889306B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2015 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Jul 11, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.