Facilitated processing for controlling bonding between sheet and carrier
US9889635B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2013 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | May 4, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming an article from a glass sheet (20) having a glass-sheet bonding surface (24) and a glass carrier (10) having a carrier bonding surface (14). At least one of the glass sheet and carrier bonding surfaces is coated with a surface modification layer (30), and then the glass sheet is connected with the carrier via the surface modification layer. From the perimeter of the glass sheet and the carrier while connected, there is removed a portion of the surface modification layer so as to expose a portion (19, 29) of the bonding surface on each of the glass sheet and the carrier. The glass sheet and carrier are then heated at a temperature ≧400° C. so as to bond the perimeter of the glass sheet (26) with the perimeter of the carrier (16).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.