Developing solution and development processing method of photosensitive resin composition
US9891527B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2014 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Jan 30, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A developing solution for a polyimide precursor containing N,N,N′,N′-tetramethylurea and a lower alcohol having 1 to 5 carbon atoms. The developing solution increases a development margin and results in little or no decrease of the film thickness of a polyimide-based resin film. A development processing method of a photosensitive polyimide resin composition including developing a photosensitive polyimide precursor resin composition, at least a part of which is exposed, with the developing solution; and a pattern formation method including forming a coating film or molding including a photosensitive polyimide precursor resin composition, selectively exposing the coating film or molding, and developing the exposed coating film or molding by the development processing method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.