Semiconductor module having stacked insulated substrate structures
US9892993B2 · kind B2 · utility
1Cited by
9References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 28, 2015 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Apr 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module (100) has a first insulating substrate (11); a first conductor layer (12) provided on a mounting surface of the first insulating substrate (11); a first electronic element (13) provided on the first conductor layer (12); a sealing resin (80), which covers an overall mounting region within the mounting surface of the first insulating substrate (11), the first conductor layer (12), and the first electronic element (13); and a frame body (70), which is made of metal and covers the overall sealing resin (80).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.