Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

US9893232B2 · kind B2 · utility

Assignees

• OSRAM Opto Semiconductors GmbH · DE
• OSRAM GmbH · DE

Inventors

• Bernd Boehm · Obertraubling, DE
• Daniel Zaspel · Regenstauf, DE
• Stefan Hartauer · Wolfsegg, DE
• Bjoern Hoxhold · Sinzing, DE

Key dates

• Filing date: Sep 24, 2015
• Grant date: Feb 13, 2018
• Expiry date: Sep 24, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8582

Abstract

The invention provides an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component (10), comprising the following steps: A) arranging at least one semiconductor chip (2) on a carrier (1), B) applying an electrically insulating photoresist (3) to a top side (1a) of the carrier (1) and to the semiconductor chip (2), C) curing the photoresist (3) with a baking step, D) patterning the photoresist (3) by exposure, F) developing the photoresist (3), wherein the photoresist (3) is removed at least from a radiation penetration surface (2b) of the semiconductor chip (2), G) again curing the photoresist (3) with a baking step, and H) applying an electrically conductive contact layer (4) to the photoresist (3), wherein the electrically conductive contact layer (4) is in places at a distance (A) from a marginal surface (3a) of the photoresist (3) which faces towards the semiconductor chip (2), wherein the marginal surface (3a) facing towards the semiconductor chip (2) is exposed in places.