Light-emitting device packages and methods of manufacturing the same
US9893251B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2016 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Nov 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8516
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting device package includes a plurality of luminescent structures arranged spaced apart from each other in a horizontal direction, an intermediate layer on the plurality of luminescent structures, and wavelength conversion layers on the intermediate layer, the wavelength conversion layers vertically overlapping separate, respective luminescent structures of the plurality of luminescent structures. The intermediate layer may include a plurality of layers, the plurality of layers associated with different refractive indexes, respectively. The intermediate layer may include a plurality of sets of holes, each set of holes may include a separate plurality of holes, and each wavelength conversion layer may vertically overlap a separate set of holes on the intermediate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.