Prepreg, metal-clad laminated plate and printed wiring board
US9894761B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Jun 5, 2016 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Jun 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/029
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.