Multilayer electronic component, manufacturing method thereof, and board having the same mounted thereon
US9894768B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2014 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Jun 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/0066
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.