ACF sticking method and ACF sticking apparatus
US9894777B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 14, 2016 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | May 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0264
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An Anisotropic Conductive Film (ACF) is stuck to a substrate by: under-receiving the substrate on which a film-shaped component is mounted by a under-receiving section, increasing an interval between a sticking head and the under-receiving section in the under-receiving step; transporting a tape member in which a base tape is bonded to the ACF and causing a sticking surface of the ACF to face the substrate, pressing the ACF together with the base tape on the substrate and sticking the ACF to the substrate, peeling the ACF sticking to the substrate from the base tape by moving a peeling member in a horizontal direction by causing the peeling member to be interposed between the ACF and the base tape, and regulating an upward warpage deformation of the component during peeling the ACF from the base tape by moving the peeling member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.