Thermal sink with an embedded heat pipe
US9894803B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 18, 2016 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Nov 18, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3672
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Heat sinks and thermal cooling systems are disclosed. The heat sinks and thermal cooling systems include fins, which extend away from a surface of a base of the heat sink, and which are located in a finned region on the surface. The heat sinks and thermal cooling systems also include one or more heat pipes that are positioned and shaped in a way so that a first portion of each heat pipe is in contact with the surface of the base, while at least a second portion of each heat pipe is raised above the surface of the base in into contact with fins in the finned region. Raising the heat pipes away from the surface of the base prevents components in contact with, or adjacent to, the base from being heated by the heat pipes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.