Method and system for gilding a substrate
US9895903B2 · kind B2 · utility
0Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2015 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Mar 23, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB44C1/14
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method for the gilding of a substrate with the application of pressure between the zones of the substrate to be gilded and a gilding sheet comprising a gilding film and a transfer layer, characterized by the consecutive treatment of the gilded substrate, allowing the adhesion performance of the gilding sheet in relation to the substrate to be optimized while improving the visual quality of the gilding deposit on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.