Patent · US Active

Method for preparing element diffusion-type composite substrate

US9896746B2 · kind B2 · utility

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6Claims
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Key dates

Filing dateMay 13, 2015
Grant dateFeb 20, 2018
Priority date
Expiry dateNov 1, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10N60/0576
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A method for preparing element diffusion-type composite substrate and it belongs to the field of high-temperature coated superconductor substrate preparation. The rolled composite nickel-tungsten alloy substrate is heated and thermally insulated, meanwhile, both ends of the rolled substrate are applied with a low voltage and high current density pulse current. High-performance nickel-tungsten alloy composite substrate is obtained with the method in the present invention and the sandwich-like composite substrate has low ferromagnetism and high strength due to higher solute diffusion from inner layer to outer layer, yet which does not affect the formation of sharp cubic texture on the surface of the composite substrate. On the one hand, the adoption of electric pulse technology accelerates the interdiffusion effect of inter-layer elements, on the other hand, it promotes the recrystallization nucleation and reduces the recrystallization annealing temperature of the composite substrate, thus energy saving effect is achieved and the negative effects of annealing thermal erosion grooves among crystal boundary to subsequent coating are effectively reduced. Alloy composite substrate prepar…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.