Use of vacuum chucks to hold a wafer or wafer sub-stack
US9899251B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2017 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Sep 8, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2551/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.