Semiconductor device
US9899336B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2014 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Apr 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A scale-like portion wherein metal plating is changed into a scale-like form is provided by continuously carrying out laser spot irradiation on a lead frame, the front surface of which is coated with the metal plating. The scale-like portion is disposed in an optional portion of the lead frame, for example, in the vicinity of a gate break mark, in an outer peripheral portion in a region sealed with a molding resin, or around a semiconductor element. The adhesion between the lead frame and the molding resin improves owing to the anchor effect of the scale-like portion, and it is thus possible to suppress the molding resin separating from the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.