Data storage device and an electronic device including the same
US9899352B2 · kind B2 · utility
3Cited by
6References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 27, 2016 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Nov 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A data storage device may include a package substrate, and an upper semiconductor chip disposed above a top surface of the package substrate. At least one lower bump is disposed on a bottom surface of the package substrate. A lower semiconductor chip is disposed on the bottom surface of the package substrate and spaced apart from the at least one lower bump. The lower semiconductor chip is thinner than the at least one lower bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.