Chip heater and heating aid arrangement
US9900975B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2016 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Mar 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/18
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A chip heater and heating air arrangement includes a circuit module including a circuit board, chip unit mounted on the circuit board and locating member mounted around the chip unit, heating aid including flat heat-transfer base panel, locating structure mounted in the flat heat-transfer base panel and attached to the chip unit and mounting structure outwardly extended from the flat heat-transfer base panel and fastened to the locating member, heater fastened to the locating structure of the heating aid, and heat dissipating mechanism including a heat-transfer holder plate attached to the heater. If the temperature of the chip unit goes below 0° C., the heater is turned on to generate heat and enabling generated heat to be transferred through the heating aid to heat the chip unit to the normal operating temperature level, enabling the computer device that uses the chip heater and heating air arrangement to work under cold environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.