Method of cooling series-connected heat sink modules
US9901013B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2015 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Nov 12, 2035 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2400/0409
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method of cooling two or more heat-providing surfaces using a cooling apparatus having two or more fluidly connected heat sink modules in a series configuration can include providing a flow of single-phase liquid coolant to a first heat sink module mounted on a first heat-providing surface. The method can include projecting the flow of single-phase liquid coolant against the first heat-providing surface within the first heat sink module and causing phase change of a first portion of the liquid coolant and thereby forming two-phase bubbly flow with a first quality. The method can include transporting the two-phase bubbly flow to a second heat sink module and projecting the two-phase bubbly flow against a second heat-providing surface within the second heat sink module and causing phase change of a second portion of the coolant and formation of two-phase bubbly flow with a second quality greater than the first quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.