Method of forming film for a component
US9902094B2 · kind B2 · utility
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4Claims
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Key dates
| Filing date | Apr 16, 2015 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Mar 23, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2791/006
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of forming a film on a component includes providing a curing device. The curing device includes a grooved receiving die, a suction device, and a UV curing system. The suction device vacuum-lifts the component into the groove and a gap between the component and the groove is thus created. A vacuum is created in the gap and a UV curing glue is injected into the gap, the UV curing glue being selected from a monomer, an oligomer, and a photoinitiator. The UV curing glue is cured by the UV curing system and the component with a cured film is easily demolded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.