Miniaturized and ruggedized wafer level MEMs force sensors
US9902611B2 · kind B2 · utility
16Cited by
145References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2015 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Jan 13, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0048
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.