Patent · US Active

Miniaturized and ruggedized wafer level MEMs force sensors

US9902611B2 · kind B2 · utility

16Cited by
145References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 13, 2015
Grant dateFeb 27, 2018
Priority date
Expiry dateJan 13, 2035

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01L9/0048
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.