Copolymerized polyamide resin, method for preparing the same and molded article comprising the same
US9902808B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2014 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Mar 15, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G69/30
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R1 is independently a C1 to C5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C1 to C10 hydrocarbon group, R2 and R3 are each independently a C1 to C5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.