Photosensitive adhesive
US9902881B1 · kind B1 · utility
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2Claims
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Key dates
| Filing date | Nov 29, 2016 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Nov 29, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2312/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A photosensitive adhesive is polymerized by a cinnamate monomer and a monomer A. By irradiating under different light waves, triggering reversible cyclization causes the adhesion force of the adhesive to change. The adhesion force change is repeatable. Therefore, the efficiency of the manufacture process would increase, and the cost of material would be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.