Meandering interconnect on a deformable substrate
US9904425B2 · kind B2 · utility
1Cited by
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20Claims
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Key dates
| Filing date | May 10, 2013 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Sep 13, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04102
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus including a first plurality of first conductive lines; and a first meandering interconnect supported in a spaced relationship from a deformable substrate, wherein the first meandering interconnect includes a first multiplicity of meandering conductive lines each of which is electrically connected to one of the first plurality of first conductive lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.